Polyoxypropylenediamine, ~230 MW
The short-chain sibling of D-2000: a low-viscosity amine widely used as a flexible, low-color epoxy hardener.
D-230 is a polyoxypropylenediamine with a molecular weight of about 230 g/mol: just a few propylene oxide units capped with primary amines. It shares a CAS number with D-2000 because only the chain length differs. Its AHEW is about 60 g/eq.
D-230 is mainly an epoxy curing agent, used alone or blended for clear, tough, low-viscosity epoxy coatings, composites and adhesives. It gives longer pot life and more flexibility than short aliphatic amines like TETA.
Its four active amine hydrogens open epoxide rings to build a crosslinked network. The ether backbone adds flexibility and reduces brittleness, and its amines sit next to methyl groups, which moderates reactivity. With a standard liquid BPA epoxy (EEW ~188), the stoichiometric level is about 32 phr.
D-230 is corrosive to skin and eyes and can cause sensitization. Use gloves and goggles, and avoid breathing mist. Keep containers closed.
For stoichiometric cure, phr = AHEW × 100 ÷ EEW. With AHEW 60 and EEW 188 that is about 32 parts per 100 parts resin. Commercial products have fixed ratios on their TDS.
It can serve as a chain extender in some polyurea formulations, but its main use is curing epoxies.
